• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method for producing a hairspring of predetermined stiffness comprising the steps of manufacturing a hairspring (5a) according to oversize dimensions, determining the stiffness of the hairspring formed so as to remove, in a manner localized, the volume of material to obtain the spiral to the dimensions necessary for said predetermined stiffness. The invention relates to the field of watchmaking.
    公开号:CH711962A2
    申请号:CH01871/15
    申请日:2015-12-18
    公开日:2017-06-30
    发明作者:Kohler Frédéric；Bucaille Jean-Luc；Hunziker Olivier
    申请人:Csem Centre Suisse D'electronique Et De Microtechnique Sa – Rech Et Développement；
    IPC主号:
    专利说明:

    Description
    FIELD OF THE INVENTION [0001] The invention relates to a method for manufacturing a hairspring of predetermined stiffness and, more specifically, to such a hairspring used as a compensating hairspring cooperating with a predetermined inertia beam to form a hairspring. resonator having a predetermined frequency.
    BACKGROUND OF THE INVENTION [0002] It is explained in EP 1 422 436, incorporated by reference into the present application, how to form a compensating balance spring comprising a silicon core coated with silicon dioxide and cooperating with a balance wheel. predetermined inertia for thermally compensating the assembly of said resonator.
    [0003] Making such a compensating hairspring provides many advantages but also has drawbacks. In fact, the step of etching several spirals in a silicon wafer offers a non-negligible geometrical dispersion between the spirals of the same wafer and a greater dispersion between spirals of two wafers etched at different times. Incidentally, the stiffness of each spiral engraved with the same engraving pattern is variable by creating significant manufacturing dispersions. SUMMARY OF THE INVENTION [0004] The object of the present invention is to overcome all or part of the disadvantages mentioned above by proposing a method of manufacturing a spiral whose dimensions are sufficiently precise not to require retouching.
    For this purpose, the invention relates to a method of manufacturing a hairspring of a predetermined stiffness comprising the following steps: - a) forming a hairspring according to dimensions greater than the dimensions necessary to obtain said hairspring; a predetermined stiffness; b) determining the stiffness of the hairspring formed during step a); - c) calculate the thickness of the material to be removed to obtain the dimensions necessary to obtain said hairspring of a predetermined stiffness; d) withdrawing the hairspring formed during step a), said thickness of material making it possible to obtain the hairspring with the dimensions required for said predetermined stiffness, said thickness of material being removed non-homogeneously along the hairspring.
    It is therefore clear that the method ensures a very high dimensional accuracy of the spiral and, incidentally, to ensure a more precise stiffness of said spiral. Each manufacturing parameter, which can induce geometric variations during step a), can thus be completely rectified for each spiral manufactured or rectified on average for all the spirals formed on the same wafer to drastically reduce the scrap rate. . In addition, the non-homogeneous nature of the material removal performed in step d) can confer additional advantages on the hairspring, particularly in terms of simplicity of manufacture.
    According to other advantageous variants of the invention: during step a), the dimensions of the spiral formed during step a) are between 1% and 20% greater than those necessary to obtain said spiral to said predetermined stiffness; step a) is carried out using deep reactive ion etching or chemical etching; during step a), several spirals are formed in the same plate in dimensions larger than the dimensions necessary to obtain several spirals of a predetermined stiffness or several spirals of several predetermined stiffnesses; the spiral formed during step a) is based on silicon, glass, ceramic, metal or metal alloy; step b) comprises the phases b1): measuring the frequency of an assembly comprising the spiral formed during step a) coupled with a balance having a predetermined inertia and b2): deducing from the measured frequency, the stiffness of the hairspring formed during step a); according to a first variant, step d) comprises the step d1): machining by means of a laser the spiral formed during step a) in order to obtain the spiral with the dimensions necessary for said predetermined stiffness; according to a second variant, step d) comprises the phases d1): oxidizing the spiral formed during step a) in order to transform said thickness of silicon-based material to be removed into silicon dioxide and thus form a spiral oxidized, and d2): removing the oxidized spiral oxide to obtain the spiral to the dimensions necessary for said predetermined stiffness; in a third variant, step d) comprises the step 63): etching the spiral formed during step a) in order to obtain the spiral with the dimensions necessary for said predetermined stiffness; after step d), the method performs at least one more step b), c) and d) to refine the dimensional quality; - After step d), the method further comprises step e): forming, on at least a portion of said hairspring of a predetermined stiffness, a portion for correcting the stiffness of the hairspring and forming a hairspring less sensitive to thermal variations; in a first variant, step e) comprises the step e1): depositing a layer on a portion of the outer surface of said hairspring of a predetermined stiffness; in a second variant, the step e) comprises the phase e2): modifying the structure according to a predetermined depth of a part of the external surface of said hairspring with a predetermined stiffness; in a third variant, step e) comprises the step e3): modifying the composition according to a predetermined depth of a portion of the external surface of said hairspring with a predetermined stiffness; during step d), said thickness of material is removed in such a manner that said hairspring of predetermined stiffness produces a gait deviation due to the lack of concentricity of its development which is equal to or differs at most from ± 20 % and / or at most ± 5 seconds / day, of the corresponding operating gap produced by the hairspring formed during step a), said walking gaps being each measured at an amplitude of oscillation of 150 ° by ratio to an oscillation amplitude of 330 °; in step d), said thickness of material is removed in first discrete zones of the spiral formed during step a) and is not removed in second discrete zones which alternate with the first discrete zones along spiral; the first discrete zones have substantially the same angular extent; the first discrete zones are distributed substantially regularly along the said spiral formed during step a): the second discrete zones have substantially the same angular extent; the second discrete zones have substantially the same angular extent as the first discrete zones; the first discrete zones each have an angular extent less than about 140 ° or between about 240 ° and about 360 °; during step d), said thickness of material is removed according to the thickness, according to the height or the thickness and the height of the hairspring formed during step a).
    BRIEF DESCRIPTION OF THE DRAWINGS [0008] Other particularities and advantages will become clear from the description which is given hereinafter, by way of indication and in no way limitative, with reference to the appended drawings, in which: FIG. 1 is a perspective view of an assembled resonator according to the invention; fig. 2 is an example of spiral geometry according to the invention; figs. 3 to 5 are spiral sections at different stages of the process according to the invention; fig. 6 is a perspective representation of a step of the method according to the invention; fig. 7 is a diagram of the process according to the invention; figs. 8 and 9 show two spirals according to the invention having non-homogeneous distributions of different material; fig. 10 shows sections of two discrete areas of either of the spirals illustrated in FIGS. 8 and 9; fig. 11 shows five isochronism curves obtained respectively with five different spirals; fig. 12 shows on an enlarged scale four of the five aforementioned isochronous curves; fig. 13 is a relative deviation diagram of a sprung balance according to an inhomogeneous distribution parameter of material on the spiral.
    Detailed Description of the Preferred Embodiments [0009] As illustrated in FIG. 1, the invention relates to a resonator 1 of the balance 3-spiral type 5. The balance 3 and the spiral 5 are preferably mounted on the same axis 7. In such a resonator 1, the moment of inertia / balance 3 responds to the formula:
    (1) in which m represents its mass and r its radius of gyration which also depends on the temperature via the coefficient of expansion ab of the balance.
    In addition, the stiffness C of a spiral 5 with a constant section corresponds to the formula:
    (2) in which E is the Young's modulus of the material used, its height, its thickness and L its developed length.
    In addition, the stiffness C of a spiral 5 variable section meets the formula:
    (3) wherein E is the Young's modulus of the material used, its height, its thickness, its developed length and the curvilinear abscissa along the turn.
    In addition, the stiffness C of a spiral 5 variable thickness but constant height meets the formula:
    (4) wherein E is the Young's modulus of the material used, its height, its thickness, its developed length and the curvilinear abscissa along the turn.
    Finally, the frequency / resonator 1 sprung balance responds to the formula:
    (5) [0014] According to the invention, it is desired that the variation of the frequency as a function of the temperature of a resonator is substantially zero. The variation of the frequency / as a function of the temperature T in the case of a sprung balance resonator substantially follows the following formula:
    (6) where:
    is the relative frequency variation; - AT is the variation of the temperature;
    is the relative variation of the Young's modulus as a function of the temperature, ie the thermoelastic coefficient (GTE) of the spiral; - as is the coefficient of expansion of the spiral, expressed in ppm. ° C'1; - ah is the coefficient of expansion of the balance, expressed in ppm.'C-1; Oscillations of any resonator for a time base or frequency to be maintained, the thermal dependence also includes a possible contribution of the maintenance system such as, for example, a Swiss lever escapement (not shown) cooperating with the pin 9 of the plate 11 also mounted on the axis 7.
    It is therefore understood from formulas (1) - (6), that it is possible to pair the hairspring 5 with the balance 3 so that the frequency / resonator 1 is almost insensitive to temperature changes.
    The invention relates more particularly to a resonator 1 in which the hairspring 5 is used to compensate the entire resonator 1, that is to say all the parts and in particular the balance 3. Such a hairspring 5 is generally called a compensating hairspring. Therefore, the invention relates to a manufacturing method for ensuring a very high dimensional accuracy of the spiral and, incidentally, to ensure a more precise stiffness of said spiral.
    According to the invention, the compensating spiral 15 is formed from a material, optionally coated with a thermal compensation layer, and intended to cooperate with a balance 3 predetermined inertia. However, nothing prevents to provide a pendulum with movable weights to offer a setting parameter before or after the sale of the timepiece.
    The use of a material, for example based on silicon, glass or ceramic, for the manufacture of a spiral 5, 15 offers the advantage of being precise by the existing engraving methods and possess good mechanical and chemical properties, in particular being very insensitive to magnetic fields. It must however be coated or superficially modified to form a compensating hairspring.
    Preferably, the silicon-based material used as compensating spiral may be monocrystalline silicon regardless of its crystalline orientation, doped monocrystalline silicon whatever its crystalline orientation, amorphous silicon, porous silicon, polycrystalline silicon, silicon nitride, silicon carbide, quartz whatever its crystalline orientation or silicon oxide. Of course other materials can be envisioned as a glass, a ceramic, a cermet, a metal or a metal alloy. For simplicity, the explanation below will be focused on a silicon-based material.
    Each type of material may be superficially modified or coated with a layer to thermally compensate the base material as explained above.
    If the step of etching spirals in a silicon-based wafer, by means of a deep reactive ion etching (also known by the abbreviation "DRIE"), is the most accurate phenomena that occur during engraving or between two successive engravings can nevertheless induce geometric variations.
    Of course, other types of manufacturing can be implemented, such as laser etching, localized ion etching (known by the abbreviation "FIB"), galvanic growth, growth by chemical deposition in phase gaseous or chemical etching, which are less accurate and for which the process would make even more sense.
    Thus, the invention relates to a method 31 for manufacturing a spiral 5c. According to the invention, the method 31 comprises, as illustrated in FIG. 7, a first step 33 intended to form at least one hairspring 5a, for example based on silicon, in dimensions Da greater than the dimensions Db necessary to obtain said hairspring 5c of a predetermined stiffness C. As shown in fig. 3, the spiral section 5a has a height H-ι and a thickness E-i.
    Preferably, the dimensions Da of the spiral 5a are substantially between 1% and 20% higher than those Db spiral 5c necessary to obtain said spiral 5c of a predetermined stiffness C.
    Preferably, according to the invention, step 33 is carried out using a deep reactive ion etching in a wafer 50 of a silicon-based material as illustrated in FIG. 6. Although this is not shown, the opposite flanks F 1, F 2 are in this case corrugated because a deep reactive ion etching of the Bosch type causes a slot etching structured by the successive stages of attack and passivation.
    Of course, the method can not be limited to a particular step 33. By way of example, step 33 could equally well be obtained by chemical etching in a wafer 50 of a material for example based on silicon. In addition, step 33 means that one or more spirals are formed, i.e., step 33 makes it possible to form bulk spirals or alternately formed in a wafer of a material.
    Therefore, during step 33, several spiral 5a can be formed in the same wafer 50 according to dimensions Da, Hi, E-ι greater than the dimensions Db, H3, E3 necessary to obtain several spirals 5c d ' a predetermined stiffness C or several spirals 5c of several predetermined stiffnesses C.
    Step 33 is not limited to the formation of a spiral 5a in dimensions Da, Hi, E-ι greater than the dimensions Db, H3, E3 necessary to obtain a spiral 5c of a stiffness C predetermined, formed using a single material. Thus, step 33 could equally well form a hairspring 5a according to dimensions Da, Hi, E-ι greater than the dimensions Db, H3, E3 necessary to obtain a hairspring 5c of a predetermined stiffness C of a composite material, c that is to say comprising several different materials.
    The method 31 comprises a second step 35 for determining the stiffness of the hairspring 5a. Such a step 35 may be carried out directly on the hairspring 5a still attached to the wafer 50 or on the hairspring 5a previously detached from the wafer 50, on the whole or on a sample of the spirals still attached to a wafer 50 or on a sample spirals previously detached from a wafer 50.
    Preferably according to the invention, the hairspring 5a being detached or not from the wafer 50. the step 35 comprises a first phase intended to measure the frequency / of an assembly comprising the hairspring 5a coupled with a balance provided with a predetermined inertia I then, using the relation (5), deduce, in a second phase, the stiffness C spiral 5a.
    Such a measurement phase can in particular be dynamic and performed according to the teachings of EP 2423 764, incorporated by reference in the present application. However, alternatively, a static method, carried out according to the teachings of document EP 2 423 764, can also be used to determine the stiffness C of the spiral 5a.
    Of course, as explained above, the method is not limited to the etching of a single spiral per wafer, step 35 may also consist of a determination of the average stiffness of a representative sample or the set of spirals formed on the same plate.
    Advantageously according to the invention, from the determination of the stiffness C of the spiral 5a, the method 31 comprises a step 37 intended to calculate, using the relation (2), the thickness of material to withdrawing on the assembly of the hairspring to obtain the overall dimensions Db necessary to obtain said hairspring 5c of a predetermined stiffness C, that is to say the volume of material to be removed on the surface of the hairspring 5a.
    The method is continued with a step 39 for removing the excess material of the hairspring 5a to the dimensions Db necessary to obtain said hairspring 5c of a predetermined stiffness C. It is therefore understood that it does not matter that the geometrical variations have intervened on the thickness and / or the height of the hairspring 5a insofar as, according to equation (2), it is the product h e3 which determines the rigidity of the turn.
    According to the invention, the removal of the excess material of the spiral 5a is performed in a non-homogeneous manner, that is to say in a manner that varies along the spiral 5a. Thus, for example, hairspring material 5a may be removed only in discrete areas or sections of said hairspring, or may be removed all along the hairspring but more in some areas than in others, or may be removed according to thickness E-ι in certain zones and according to height H, in other zones. The aforementioned dimensions Db, H3, Es required to obtain the spiral 5c of a predetermined stiffness C are therefore average dimensions (averaged over the length of the spiral) of the spiral section 5c. As shown in FIG. 4, these dimensions Db comprise an average height H3 and an average thickness E3. The average height H3 is less than the height Hs of the hairspring 5a, and / or the average thickness E3 is less than the thickness E-1 of the hairspring 5a. As is apparent from formula (2), the thickness of the material to be removed to obtain the predetermined stiffness C is much lower if it is removed according to the thickness E-ι of the spiral section 5a rather than the height H, . However, a removal of material according to the thickness E-, requires a greater machining precision.
    Removing excess material inhomogeneously along the hairspring 5a in step 39 has several advantages: i) the manufacture of hairspring 5c can be faster and less expensive because the removal of material has no need to be performed on the entire hairspring; ii) it is possible to limit the removal of material to areas of the hairspring which are more accessible than others, for example the first and / or the last turn and / or turns having a larger pitch, in order to avoid touching or contaminating adjacent turns; iii) according to the method used for step 39, removing material in shorter lengths and for a shorter time can promote better control of the process, in terms of, for example, alignment of the machining or drifting device machining power; iv) a lower machining precision is necessary to obtain the predetermined stiffness C, in particular in the case of a material removal according to the thickness E-ι since the thickness to be removed in the selected zones is greater than the thickness that should be removed over the entire length of the hairspring 5a to obtain the same stiffness C; v) in the case of a hairspring 5a of non-constant section, the removal of material can be advantageously carried out in areas of the hairspring 5a where the dimensions of the section are the largest, to better control the effect of modification of the stiffness C of the spiral, or conversely in the less rigid zones of the spiral 5a to gain speed and cost of manufacture; (vi) if the removal of material modifies the surface condition, thereby resulting in a deterioration of mechanical strength or aesthetics, it may be chosen to remove the material only in areas which are less mechanically stressed or which do not are not visible.
    In a particular embodiment, the removal of material in step 39 is performed by means of a laser. However, variations are possible, such as chemical etching or localized ion etching, using masks to protect areas of the hairspring in which removal of material is not desired. Another variant, in the case of a silicon-based material, may consist in oxidizing the spiral 5a in certain zones, using masks, in order to transform the thickness of the material to be removed into silicon dioxide, then remove the oxide. The oxidation can be carried out thermally, for example between 800 and 1200 ° C under an oxidizing atmosphere using water vapor or oxygen gas. The masks may be nitride. The oxide formed on the silicon can be removed by a chemical bath comprising for example hydrofluoric acid.
    According to the arrangement of the zones chosen for the removal of material in step 39, the isochronism defect of the sprung-balance resonator due to the development of the spiral 5c will be modified or not compared to the spiral 5a formed in the step 33. Indeed, in operation, according to the arrangement of said selected zones, the development of the spiral 5c will be more or less concentric, generating greater or lesser forces on the pivots of the balance and on the mounting point of the spiral. We know that a conventional spiral constant section develops eccentrically. A spiral with a variable cross section may, depending on the case, develop more concentrically, less concentrically or as concentrically as a spiral with a constant section and thus respectively improve, deteriorate or preserve the isochronism. In the present invention, it is possible to remove the excess material of the hairspring 5a in step 39 without degrading the isochronism and while obtaining at least part of the advantages i) to vi) stated above.
    To illustrate this advantageous characteristic of the invention, FIGS. 8 and 9 show two examples of spirals 5c ', 5c "each having first discrete zones 20, shown in broken lines, in which material has been removed in step 39. These first discrete zones 20 alternate along the spiral with second discrete zones 21, shown in solid lines, in which no material removal has been performed In the first discrete zones 20, the height of the hairspring has been decreased from Hi = 120 μm to H3 '= 100 μm for example by laser ablation, whereas in the second discrete zones 21 the height of the hairspring has been kept unchanged at 1-1 - = 120 μm (see Fig. 10). In each of these examples, the average height H 3 of the hairspring between the heights H 1 and H 3 'is that which makes it possible to obtain said predetermined stiffness C. Preferably, as shown, the first discrete zones 20 are reg distributed along the spiral and have the same angular extent a, measured from the geometric center of the spiral, which angular extent a is identical to the angular extent β of the second discrete zones 21. It could however be otherwise.
    In the examples of FIGS. 8 and 9, the angular extent a = 3 is 90 ° and 360 °, respectively.
    Figs. 11 and 12 show isochronism curves J1 to J5 obtained from different spirals, namely for the curve J1 the spiral 5c 'illustrated in FIG. 8, for the curve J2 the spiral 5c "illustrated in Fig. 9, for the curve J3 a spiral which differs from the spirals 5c 'and 5c" in that the discrete zones 20, 21 each extend over 180 °, for the curve J4 a spiral which differs from the spirals 5c 'and 5c "in that the discrete zones 20,21 each extend over 210 °, and for the curve J5 the spiral 5a with a constant section obtained in step 33. isochronism curves J1 to J5 represent, for each hairspring, the variations in the girth of the balance-spring resonator, in seconds / day, as a function of the oscillation amplitude of the balance-spring resonator, in degrees. of walking due to the eccentric development of the spiral are taken into account here, which means that it does not take into account in particular the effects due to the pendulum nor the differences in operation between the different positions of the resonator.
    Each curve J1 to J5 is obtained by numerical simulation, considering the outer end 23 of the hairspring as fixed and the balance shaft to which is fixed the inner end 24 as free (that is to say no mounted in bearings), by finite element calculation of the displacement of the center of rotation 25 of the spiral during oscillations of the balance, then interpolating and integrating the displacement curve as a function of the amplitude of oscillation. Analytical equations connecting the displacement of the center of rotation of the spiral to the gait as a function of the oscillation amplitude of the balance are proposed, for example, in the book "Traité de construction horlogère" by M. Vermot, P. Bovay, D. Prongué and S. Dordor, published by the Presses polytechniques et universitères romandes, 2011. The possible contacts between the turns during the expansions and contractions of the spiral are not taken into account in these simulations, these contacts being able in each case to be avoided by a simple adaptation of the spiral pitch and / or a spacing of the last turn.
    As can be seen in these figs. 11 and 12, the spirals 5c 'and 5c "(curves J1, J2) produce substantially the same gait variations as the spiral 5a (curve J5), whereas the spirals corresponding to the curves J3 and J4 degrade the isochronism of the resonator relative to the hairspring 5a, this due to a very eccentric development, similar results would be obtained by modifying not the height of the hairspring 5a but its thickness.
    In FIG. FIG. 13 shows the relative operating gap M as a function of the angular extent a, in degrees, of each discrete zone 20, 21. By "relative operating gap" is meant the following quantity, expressed as a percentage:
    where Ma is the difference between walking at 150 ° and walking at 330 "for a given hairspring 5c having discrete areas 20, 21 of angular extent α, and Mc is the difference between walking at 150 ° and walking at 330 ° for the spiral 5a corresponding to constant section. It can be deduced from this diagram that for angles between 0 ° and 140 ° or between 240 ° and 360 °, the spiral 5c degrades little or not degrades the isochronism of the resonator relative to the spiral 5a, l relative difference M in absolute value being less than 20% and may even be less than 10% or even 5%. The magnitude Ma - Mc in absolute value can itself be less than 5 seconds / day.
    Step 39 may finish the process 31. However, after step 39, the method 31 may also perform, at least one more time, steps 35, 37 and 39 in order to further refine the quality. dimensional spiral. These iterations of steps 35, 37 and 39 may, for example, be of particular interest when the execution of the first iteration of steps 35, 37 and 39 is performed on the set, or on a sample, of the spirals still attached to a wafer 50, then in a second iteration, on the assembly, or a sample, spirals previously detached from the wafer 50 having undergone the first iteration.
    权利要求:
    Claims (30)
    [1]
    1. A method (31) for manufacturing a hairspring (5c) of a predetermined stiffness (C) comprising the following steps: a) forming (33) a hairspring (5a) according to dimensions (Da, Η ·, E ·,) Greater than the dimensions (Db, H3, E3) necessary to obtain said hairspring (5c) of a predetermined stiffness (C); b) determining (35) the stiffness (C) of the hairspring (5a) formed in step a); c) calculating (37) the thickness of material to be removed to obtain the dimensions (Db, H3, E3) necessary to obtain said hairspring (5c) of a predetermined stiffness (C); d) removing (39) from the hairspring (5a) formed during step a), said material thickness making it possible to obtain the hairspring (5c) with the dimensions (Db, H3, E3) necessary for said predetermined stiffness (C) said material thickness being removed non-homogeneously along the hairspring (5a).
    [2]
    2. Method (31) of manufacture according to the preceding claim, characterized in that the dimensions (Da, Hi, E-ι) of the spiral (5a) formed in step a) are between 1% and 20% greater than those (Db, H3, E3) necessary to obtain said hairspring (5c) at said predetermined stiffness (C).
    [3]
    3. Method (31) of manufacture according to claim 1 or 2, characterized in that step a) is carried out using a deep reactive ion etching.
    [4]
    4. Method (31) of manufacture according to claim 1 or 2, characterized in that step a) is carried out using a chemical etching.
    [5]
    5. Method (31) of manufacture according to one of the preceding claims, characterized in that, in step a), several spirals (5a) are formed in a same plate (50) in dimensions (Da, H · ,, E ·,) greater than the dimensions (Db, H3, E3) necessary to obtain several spirals (5c) of a predetermined stiffness (C) or several spirals (5c) of several predetermined stiffnesses (C).
    [6]
    6. Method (31) of manufacture according to one of the preceding claims, characterized in that the spiral (5a) formed in step a) is based on silicon.
    [7]
    7. The method (31) of manufacture according to one of claims 1 to 5, characterized in that the spiral (5a) formed twist of step a) is based on glass.
    [8]
    8. Method (31) of manufacture according to one of claims 1 to 5, characterized in that the spiral (5a) formed in step a) is based on ceramics.
    [9]
    9. The method (31) of manufacture according to one of claims 1 to 5, characterized in that the spiral (5a) formed in step a) is based on a metal.
    [10]
    10. Method (31) of manufacture according to one of claims 1 to 5, characterized in that the spiral (5a) formed in step a) is based on a metal alloy.
    [11]
    11. Method (31) of manufacture according to one of the preceding claims, characterized in that step b) comprises the following phases: b1) measure the frequency (/) of an assembly comprising the spiral (5a) formed during of step a) coupled with a beam having a predetermined inertia; b2) deduce from the frequency (/) measured, the stiffness (C) of the spiral (5a) formed during step a).
    [12]
    12. Method (31) of manufacture according to one of the preceding claims, characterized in that step d) comprises the following phase: d1) machining by means of a laser spiral (5a) formed during step a) in order to obtain the hairspring (5c) with the dimensions (Db, Hs, Es) necessary for said predetermined stiffness (C).
    [13]
    13. The method (31) of manufacture according to claim 6, characterized in that step d) comprises the following phases: d2) oxidize the spiral (5a) formed during step a) to transform said thickness of material silicon-based material to be removed from silicon dioxide and thus forming an oxidized spiral (5b); d3) removing oxide oxidized spiral (5b) to obtain the spiral (5c) dimensions (Db, H3, E3) required for said stiffness (C) predetermined.
    [14]
    14. The method (31) of manufacture according to one of claims 1 to 11, characterized in that step d) comprises the following phase: d4) etch the spiral (5a) formed in step a) so to obtain the hairspring (5c) of dimensions (Db, H3, E3) necessary for said predetermined stiffness (C).
    [15]
    15. Method (31) of manufacture according to one of the preceding claims, characterized in that, after step d), the method performs at least one more time steps b), c) and d) to refine the quality dimensional.
    [16]
    16. The method (31) of manufacture according to one of the preceding claims, characterized in that, after step d), the method comprises, in addition, the following step: e) forming, on at least a part of said spiral (5c) of a stiffness (C) predetermined, a portion for correcting the stiffness of the spiral (5c) and forming a spiral (5, 15) less sensitive to thermal variations.
    [17]
    17. The method (31) of manufacture according to claim 16, characterized in that step e) comprises the following phase: e1) depositing a layer on a portion of the outer surface of said spring (5c) of a stiffness (C ) predetermined.
    [18]
    18. Method (31) for manufacturing according to claim 16, characterized in that step e) comprises the following phase: e2) modifying the structure to a predetermined depth of a portion of the outer surface of said hairspring (5c) d a predetermined stiffness (C).
    [19]
    19. The method (31) of manufacture according to claim 16, characterized in that step e) comprises the following phase: e3) modifying the composition to a predetermined depth of a portion of the outer surface of said hairspring (5c) d a predetermined stiffness (C).
    [20]
    20. Method (31) of manufacture according to one of the preceding claims, characterized in that, in step d), said thickness of material is removed in such a manner that said spiral (5c) stiffness (C a predetermined deviation produces a deviation due to the lack of concentricity of its development which is equal to or which does not differ by more than ± 20% from the corresponding step difference produced by the hairspring (5a) formed during step a), said walking distances being each measured at an oscillation amplitude of 150 ° with respect to an oscillation amplitude of 330 °.
    [21]
    21. Method (31) of manufacture according to one of the preceding claims, characterized in that, in step d), said thickness of material is removed in such a way that said spiral (5c) stiffness (C ) a predetermined deviation produces a deviation due to the lack of concentricity of its development which is equal to or which differs at most ± 5 seconds / day from the corresponding step difference produced by the hairspring (5a) formed during step a ), said gait deviations being each measured at an oscillation amplitude of 150 ° with respect to an oscillation amplitude of 330 °.
    [22]
    22. Method (31) of manufacture according to one of the preceding claims, characterized in that, in step d), said thickness of material is removed in first discrete zones (20) of the spiral (5a) formed during of step a) and is not removed in second discrete areas (21) which alternate with the first discrete areas (20) along the hairspring (5a).
    [23]
    23. The method (31) of manufacture according to claim 22, characterized in that the first discrete zones (20) have substantially the same angular extent (a).
    [24]
    24. The method (31) of manufacture according to claim 22 or 23, characterized in that the first discrete zones (20) are distributed substantially regularly along said spiral (5a) formed during step a).
    [25]
    25. The method (31) of manufacture according to one of claims 22 to 24, characterized in that the second discrete zones (21) have substantially the same angular extent (β).
    [26]
    26. The method (31) of manufacture according to claim 25, characterized in that the second discrete zones (21) have substantially the same angular extent as the first discrete zones (20).
    [27]
    27. The method (31) of manufacture according to one of claims 22 to 26, characterized in that the first discrete zones (20) each have an angular extent less than about 140 ° or between about 240 ° and about 360 °.
    [28]
    28. The method (31) of manufacture according to one of the preceding claims, characterized in that, in step d), said thickness of material is removed according to the thickness (E ·,) of the spiral (5a) formed during step a).
    [29]
    29. The method (31) of manufacture according to one of claims 1 to 27, characterized in that, in step d), said thickness of material is removed according to the height (H) of the spiral (5a) formed during step a).
    [30]
    30. Method (31) of manufacture according to one of claims 1 to 27, characterized in that, in step d), said thickness of material is removed according to the thickness (E ·,) and the height ( H ·,) of the hairspring (5a) formed during step a).
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    同族专利:
    公开号 | 公开日
    CH711962B1|2017-10-31|
    EP3181940B1|2019-02-06|
    CN106896700B|2019-10-15|
    EP3181940A1|2017-06-21|
    JP6343653B2|2018-06-13|
    US20170176941A1|2017-06-22|
    CN106896700A|2017-06-27|
    US10338528B2|2019-07-02|
    JP2017111133A|2017-06-22|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    CH01871/15A|CH711962B1|2015-12-18|2015-12-18|A method of manufacturing a hairspring of predetermined stiffness with localized removal of material|
    EP15201341.3A|EP3181940B1|2015-12-18|2015-12-18|Method for manufacturing a hairspring with a predetermined stiffness by localised removal of material|CH01871/15A| CH711962B1|2015-12-18|2015-12-18|A method of manufacturing a hairspring of predetermined stiffness with localized removal of material|
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